IC Packaging Engineering
H-1B Salary Data · 19 certified filings
$167,108Avg. Salary
$143,100Minimum
$216,091Maximum
According to TheRealSalaries.com analysis of official US Department of Labor filings (October 2024 - December 2025), the average H-1B salary for IC Packaging Engineering is $167,108 — 38% above the national median H-1B salary of $121,514. Based on 19 certified filings across all employers.
Section 1
What is the average H-1B salary for IC Packaging Engineering?
The average H-1B salary for IC Packaging Engineering is $167,108 based on 19 certified filings with the US Department of Labor. Salaries range from $143,100 to $216,091.
$167,108
Average
$143,100
Minimum
$216,091
Maximum
19
Filings
Top Companies Hiring IC Packaging Engineering
| Company | Avg. Salary | Filings |
|---|---|---|
| Apple Inc. | $167,107 | 19 |
Section 2
IC Packaging Engineering Salaries by City
| City | Avg. Salary | Filings |
|---|---|---|
| Santa Clara, CA | $167,107 | 19 |
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Sr QA Engineer ($119,806)
Mechanical Engineer III ($125,785)
Sr. Infrastructure Engineer ($143,833)
R&D Engineer II ($98,530)
Architect I ($103,675)
Senior Data Scientist I ($144,518)
Section 3
Pay for this role varies by DOL wage level — see the H-1B wage levels I–IV explained with prevailing wage data per level.
Source: US Department of Labor LCA Disclosure Data. Category: Engineering. Updated: Q1 FY2025.