IC Packaging Engineering at Apple Inc.

H-1B Salary Data · 19 certified filings

Section 1

How much does Apple Inc. pay IC Packaging Engineering?

Apple Inc. pays IC Packaging Engineering an average of $167,108 based on 19 certified H-1B filings. Salaries range from $143,100 to $216,091.

$167,108
Average
$155,043
Median
$143,100
Minimum
$216,091
Maximum

Apple Inc. pays at the industry average of $167,108 for this role.

IC Packaging Engineering at Apple Inc. by Location

LocationAvg. SalaryFilings
Santa Clara, CA $167,107 19
Section 2

Other Roles at Apple Inc.

Software Engineering Applications ($181,823) Software Development Engineering ($189,422) Software Engineering Systems ($180,779) Machine Learning ($189,466) Engineering Project/Program ($172,032)
Section 3
Source: US Department of Labor LCA Disclosure Data. Updated: Q1 FY2025.