Packaging Engineer at Qualcomm Technologies, Inc.
H-1B Salary Data · 5 certified filings
Section 1
How much does Qualcomm Technologies, Inc. pay Packaging Engineer?
Qualcomm Technologies, Inc. pays Packaging Engineer an average of $119,521 based on 5 certified H-1B filings. Salaries range from $98,500 to $140,805.
$119,521
Average
$119,434
Median
$98,500
Minimum
$140,805
Maximum
Qualcomm Technologies, Inc. pays 1.3% above the industry average of $117,956 for this role.
Packaging Engineer at Qualcomm Technologies, Inc. by Location
| Location | Avg. Salary | Filings |
|---|---|---|
| Santa Clara, CA | $140,805 | 1 |
| San Diego, CA | $119,434 | 3 |
| Austin, TX | $98,500 | 1 |
Section 2
Packaging Engineer at Other Companies
Other Roles at Qualcomm Technologies, Inc.
Section 3
Source: US Department of Labor LCA Disclosure Data. Updated: Q1 FY2025.