Packaging Engineer at Intel Corporation
H-1B Salary Data · 79 certified filings
Section 1
How much does Intel Corporation pay Packaging Engineer?
Intel Corporation pays Packaging Engineer an average of $122,963 based on 79 certified H-1B filings. Salaries range from $98,696 to $177,200.
$122,963
Average
$123,490
Median
$98,696
Minimum
$177,200
Maximum
Intel Corporation pays 4.2% above the industry average of $117,956 for this role.
Packaging Engineer at Intel Corporation by Location
| Location | Avg. Salary | Filings |
|---|---|---|
| Santa Clara, CA | $144,664 | 1 |
| Arlington, TX | $126,547 | 1 |
| Chandler, AZ | $123,537 | 56 |
| Hillsboro, OR | $120,228 | 21 |
Section 2
Packaging Engineer at Other Companies
Other Roles at Intel Corporation
Section 3
Source: US Department of Labor LCA Disclosure Data. Updated: Q1 FY2025.