Broadcom Corporation
H-1B Sponsorship & Salary Data — Government-Verified
$174,771Avg. Salary
104Filings
14+Job Titles
December 2025Last Filing
According to TheRealSalaries.com analysis of official US Department of Labor filings (October 2024 - December 2025), Broadcom Corporation pays a median H-1B salary of $173,930 — 43% above the national median of $121,514, ranking in the top 10% of 13,957 ranked H-1B sponsors. Based on 104 certified Labor Condition Applications.
Section 1
What does Broadcom Corporation pay?
Broadcom Corporation's H-1B filings show an average salary of $174,771 based on 104 certified LCA applications. Salaries range from $99,944 to $226,158.
$174,771
Average
$173,930
Median
$99,944
Minimum
$226,158
Maximum
Recent H-1B Filings
| Job Title | Salary |
|---|---|
| R&D Engineer IC Design | $170,884 |
| R&D Engineer Hardware | $147,235 |
| Field Applications Engineer | $149,691 |
| R&D Engineer Software | $178,131 |
| R&D Engineer IC Design | $216,091 |
| R&D Engineer IC Design | $113,661 |
| Manager, R&D | $195,613 |
| R&D Engineer Test | $148,944 |
| R&D Engineer IC Design | $163,218 |
| Field Applications Engineer | $149,691 |
| R&D Engineer IC Design | $205,445 |
| R&D Engineer IC Design | $137,655 |
| R&D Engineer IC Design | $142,155 |
| SAAS Platform & Delivery Engineer | $156,291 |
| R&D Engineer Software Quality | $183,586 |
| Senior Manager, R&D | $172,839 |
| R&D Engineer IC Design | $216,091 |
| Infrastructure Engineer | $168,682 |
| R&D Engineer Software Quality | $153,905 |
| R&D Engineer IC Design | $173,930 |
| R&D Engineer IC Design | $173,930 |
| R&D Engineer Hardware | $173,930 |
| R&D Engineer SW Quality | $125,219 |
| R&D Engineer IC Design | $216,091 |
| R&D Engineer IC Design | $168,352 |
| R&D Engineer IC Design | $176,134 |
| R&D Engineer IC Design | $173,930 |
| R&D Engineer Hardware | $161,179 |
| R&D Engineer IC Design | $200,839 |
| R&D Engineer SW Quality | $153,905 |
| R&D Engineer IC Design | $109,662 |
| R&D Engineer Software | $217,500 |
| R&D Engineer Software Quality | $182,701 |
| R&D Engineer IC Design | $200,839 |
| R&D Engineer IC Design | $200,839 |
| R&D Engineer Software | $177,154 |
| R&D Engineer Software | $183,153 |
| R&D Engineer IC Design | $200,839 |
| R&D Engineer Software Quality | $182,701 |
| R&D Engineer IC Design | $168,352 |
| R&D Engineer Firmware | $161,071 |
| R&D Engineer IC Design | $168,352 |
| R&D Engineer IC Design | $99,944 |
| R&D Engineer IC Design | $145,642 |
| R&D Engineer IC Design | $151,091 |
| R&D Engineer Software | $201,323 |
| SAAS Platform & Delivery Engineer | $149,781 |
| R&D Engineer IC Design | $134,597 |
| R&D Engineer Hardware | $160,638 |
| R&D Engineer Software Quality | $152,679 |
Section 2
States with Broadcom Corporation H-1B Filings
Similar Companies
Section 3
All salaries above must meet the Department of Labor's wage floor — see how the H-1B prevailing wage levels work, or browse all sponsor companies.
Source: US Department of Labor LCA Disclosure Data. Last updated: Q1 FY2025.