Senior Packaging Engineer at Qualcomm Technologies, Inc.
H-1B Salary Data · 6 certified filings
Section 1
How much does Qualcomm Technologies, Inc. pay Senior Packaging Engineer?
Qualcomm Technologies, Inc. pays Senior Packaging Engineer an average of $131,414 based on 6 certified H-1B filings. Salaries range from $119,434 to $156,853.
$131,414
Average
$128,898
Median
$119,434
Minimum
$156,853
Maximum
Qualcomm Technologies, Inc. pays 3.1% above the industry average of $127,473 for this role.
Senior Packaging Engineer at Qualcomm Technologies, Inc. by Location
| Location | Avg. Salary | Filings |
|---|---|---|
| Santa Clara, CA | $156,853 | 1 |
| Austin, TX | $127,200 | 1 |
| San Diego, CA | $126,107 | 4 |
Section 2
Other Roles at Qualcomm Technologies, Inc.
Section 3
Source: US Department of Labor LCA Disclosure Data. Updated: Q1 FY2025.