Principal Engineer Firmware Engineering at GoPro, Inc.
H-1B visa salary data from US Department of Labor filings
What does GoPro, Inc. pay Principal Engineer Firmware Engineerings?
GoPro, Inc. pays Principal Engineer Firmware Engineerings an average salary of $198,353 based on 1 certified H-1B visa filings. The salary range spans from $198,353 to $198,353, with a median of $198,353.
Source: US Department of Labor LCA Disclosure Data, Q1 FY2025
Principal Engineer Firmware Engineering Salaries at GoPro, Inc. by Location
| Location | Avg. Salary | Filings | Range |
|---|---|---|---|
| San Mateo, CA | $198,353 | 1 | $198,353 - $198,353 |
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Frequently Asked Questions
What does GoPro, Inc. pay Principal Engineer Firmware Engineerings? ▼
GoPro, Inc. pays Principal Engineer Firmware Engineerings an average salary of $198,353 based on 1 certified H-1B visa filings with the US Department of Labor.
How does GoPro, Inc. Principal Engineer Firmware Engineering salary compare to industry? ▼
GoPro, Inc. pays competitive rates for Principal Engineer Firmware Engineerings compared to industry standards.
Where does GoPro, Inc. pay Principal Engineer Firmware Engineerings the most? ▼
GoPro, Inc. pays Principal Engineer Firmware Engineerings the highest in San Mateo, CA at an average of $198,353.
Is this salary data accurate? ▼
Yes. This data comes from official Labor Condition Applications (LCAs) filed with the US Department of Labor. Companies are legally required to report accurate salaries on these forms—falsifying this information is federal fraud. This makes our data more reliable than self-reported sites like Glassdoor.