Side-by-side salary comparison based on certified H-1B filings.
Government-Verified DataMicrosoft Corporation pays 11.6% more on average
| Role | Avg Salary |
|---|---|
| Logic Design Engineer | $151,091 |
1 certified filings
| Role | Avg Salary |
|---|---|
| Software Engineering | $172,760 |
| Product Management | $180,481 |
| Technical Program Management | $181,572 |
| Silicon Engineering | $187,538 |
| Technical Support Engineering | $126,101 |
2,569 certified filings
Based on certified H-1B filings, Microsoft Corporation pays 11.6% more than Winbond Electronics Corporation America on average. Winbond Electronics Corporation America has 1 certified filings with an average salary of $151,091, while Microsoft Corporation has 2,569 filings averaging $170,833.
Source: US Department of Labor LCA Disclosure Data
